info@xsc-circuits.com
XSC-CIRCUITS is a leading manufacturer specializing in the production of HDI, rigid-flex, FPC, ceramic substrates, high-frequency, and high-precision multi-layer PCBs. Our facility employs over 300 people and is equipped with fully automated production and testing systems, including more than 100 core machines and a team of over 40 engineers. Our products are widely used in diverse industries, including automotive electronics, industrial control, power supplies, security, communication equipment, smart wearables, medical instruments, aerospace, and more.
We leverage advanced PCB manufacturing technologies, cutting-edge production processes, and robust process control techniques. Our highly skilled product development team ensures the highest standards in quality and innovation. Our product range includes 1-36 layer HDI PCBs, 1-18 layer rigid-flex PCBs, ceramic substrate PCBs, high-frequency microwave PCBs, and other specialized solutions. We offer one-stop PCB and PCBA services tailored to meet the unique needs of our clients.
At XSC-CIRCUITS, we are committed to a customer-centric and market-driven approach. We foster genuine collaboration, uphold our promises, and are dedicated to providing exceptional quality and service to customers around the globe. By striving for mutually beneficial partnerships, we actively embrace our corporate social responsibilities and aim to be a leader in promoting contemporary values and contributing to societal progress.
Production Process：DPC
Finished Board Thickness: • Aluminum Nitride: 0.38mm, 0.5mm
Surface Treatment: ENIG,Silver Immersion,Nickel-Palladium Gold
Remarks:1519、1860、3570
A Rigid-Flex PCB is a special type of circuit board made by laminating rigid PCBs (Rigid PCB) and flexible PCBs (Flex PCB) together. The rigid and flexible parts are directly connected, eliminating the need for traditional board-to-board connectors. This results in a more compact and precise PCB design with improved electrical performance.
Currently, Rigid-Flex PCBs are primarily used in industries such as healthcare and industrial control, as well as in high-end consumer electronics like smartphones and tablets. Thanks to their excellent 3D mounting capabilities and highly reliable electrical connections, Rigid-Flex PCBs are increasingly being adopted in various applications, such as the rapidly growing market of smart wearable devices and AR/VR equipment in recent years.
Flexible Printed Circuit (FPC) refers to a type of printed circuit where the circuit is printed on a flexible substrate. Compared to traditional rigid PCBs, FPCs are characterized by flexibility, foldability, lightweight, and durability, making them widely used in many modern electronic devices.
FPCs feature high wiring density, light weight, thin thickness, and good bendability. Multilayer FPCs are created by bonding multiple single-sided or double-sided FPCs together using adhesive layers and then pressing them at high temperatures. Interconnections between layers are achieved through drilling, copper plating, and electroplating. Due to the variety of materials and their different properties, the manufacturing process is highly complex.
A Ceramic Substrate PCB is an electronic substrate made from ceramic materials, typically used in high-performance and high-reliability devices. The unique properties of ceramic substrates make them ideal for high-temperature, high-frequency, high-power, and corrosive environments.
Ceramic substrate PCBs offer excellent electrical insulation, high thermal conductivity, and the ability to etch patterns like traditional PCBs. They also have high current-carrying capacity. As a result, ceramic substrates are essential in power electronics and interconnection technologies. They are used in applications like LED lighting, automotive electronics, aerospace, military electronics, and laser technologies in industrial electronics.
