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Product Details
Application: Industrial Control
Parameters:8L, Thickness 2.0mm, ENIG, Through Hole 0.2mm, Min W/S: 101/127μm
Structure:3-2F-3,Flying Tail Structure
Process:FPCB Plating, FPCB Gold Finger, LRC, MCD, PI Reinforcement with Inner Pressure, NF PP, Impedance.
Product Details
Application: Industrial Control
Parameters:4L, Thickness 1.6mm, Au Plating 16U, Through Hole 0.25mm, Min W/S: 200/265μm
Structure:1-2F-1 Symmetrical Structure
Process:FPCB Plating, Slot Hole, LRD, MCD, Short Slot
Product Details
Application: Industrial Control
Parameters:8L, Thickness 1.25mm, ENIG, Through Hole 0.25mm, Min W/S: 89/114μm
Structure:3-2F-3 Symmetrical Structure
Process:NF PP Mixed Lamination, Laser Reverse Control (LRC), Impedance, Mechanical Depth Control (MCD)
Product Details
Application: Industrial Control
Parameters:6L, Thickness 1.0mm, ENIG, Through Hole 0.2mm, Min W/S: 127/101μm
Structure:1-2F-2F +1, HDI Structure
Process:Double-sided HDI, Hole Filling, Controlled Depth Drilling, Impedance, Laser Depth Control
Product Details
Application: Industrial Control
Parameters:4L, Thickness 1.6mm, ENIG, Through Hole 0.25mm, Min W/S: 292/75μm
Structure:1-2F-1 Flying Tail Structure
Process:FPCB Gold Finger, LRC, Impedance (Z), MCD
Product Details
Application: Industrial Control
Parameters:8L, Thickness 1.2mm, ENIG, Through Hole 0.35mm, Blind Hole 0.1mm, Min W/S: 74.3/115μm, BGA 300μm
Structure:1 + (1-2F-1) + 1 HDI + Multilayer Flexible PCB Lamination Structure
Process:2-Press, Resin Fill, Laser BH, LRC, Impedance (Z), MPC
Product Details
Application: Industrial Control
Parameters:10L, Thickness 1.6mm, ENIG, Through Hole 0.25mm, Min W/S: 75/125μm, BGA: 300μm
Structure:4-2F-4 Symmetrical Structure
Process:High TG, Impedance (Z), LRC, MPC
Product Details
Application: Drone
Parameters:12L, Thickness 1.4mm, ENIG, Through Hole 0.2mm, Min W/S: 102/101μm, BGA: 254μm
Structure:5-2F-5 Symmetrical Structure
Process:High Multilayer Press, Multi-Z, LRC, MCD with Lid Opening, Resin Fill, Dispense
Product Details
Application: Automotive
Parameters:6L, Thickness 0.6mm, ENIG, Through Hole 0.2mm, Min W/S: 64/96μm, Bonding Wire: 200μm
Structure:2-2F-2
Process:NiPdAu, Wire Bonding (WB), Impedance (Z), MCD
Product Details
Application: Medical Electronics
Parameters:4L, Thickness 0.37mm, ENIG, Through Hole 0.15mm, Blind Hole 0.1mm, Min W/S: 65/110μm
Structure:1+2F+1 HDI
Process:Laser BH, LDC, Impedance (Z), Metal HS
Product Details
Application: Smart Wearables
Parameters:4L, Thickness 0.85mm, ENIG, Through Hole 0.2mm, Min W/S: 152/178μm
Structure:1-2F-1 Symmetrical Structure
Process:Dispense, Impedance (Z), V-cut, LDC
Product Details
Application: Smart Wearables
Parameters:4L, Thickness 0.8mm, ENIG, Through Hole 0.2mm, Min W/S: 170/105μm
Structure:1-2F-1
Process:Flex PCB Plating, Flex PCB HH, Impedance (Z), LDC
Product Details
Application: Wearables
Parameters:4L, Thickness 1.6mm, ENIG, Through Hole 0.2mm, Min W/S: 65/110μm
Structure:1-2F-1 Symmetrical Structure
Process:LRC, Impedance (Z), SMS, MCD
Product Details
2L Industrial Control FPC
Product Details
2L FPC
Product Details
4L FPC
Product Details
4L Consumer Electronics FPC
Product Details
2L FPC
Product Details
Layers: 6
Material: TU872 + Rogers 4350
Surface Treatment: ENIG
Thickness: 2.4mm
Min Hole: 0.2mm
Process: Step + Depth Control
Product Details
High-Speed PCB
Layers: 24
Material: Panasonic M6
Surface Treatment: Gold Immersion
Thickness: 3mm
Min Hole: 0.25mm
Trace Width/Spacing: 3.5/3.5mil
Process: Inner Holes, Back Drilling, Depth Control Step, Impedance, Outer/Inner Copper, Inner Hole to Trace 6.5mil
Product Details
High-Speed PCB
Layers: 12
Material: Panasonic M6
Surface Treatment: ENIG
Thickness: 2mm
Min Hole: 0.2mm
Trace Width/Spacing: 4/4mil
Process: 1-2/1-3/1-4/9-12/10-12/11-12 Blind Holes, Resin Plugging, Impedance
Product Details
HDI
Layers: 10
Material: FR4
Surface Treatment: ENIG
Thickness: 1.2mm
Min Hole: 0.15mm
Trace Width/Spacing: 3/4mil
Process: 3-5/6-8/3-8 Blind Holes, 2-Step Stacked Hole HDI, Resin Plugging, Impedance, Outer/Inner Copper, Inner Hole to Trace 6mil
Product Details
Product Name: Car Light
Production Process: DPC
Finished Thickness: Aluminum Nitride 0.38mm, 0.5mm
Surface Treatment: Silver Immersion, Gold Immersion, Nickel Palladium Gold
Remarks: 1519, 1860, 3570
Product Details
Product Name: COB
Production Process: LTCC
Finished Thickness: Aluminum Oxide 1.0mm
Surface Treatment: LTCC + Nickel Palladium Gold
Remarks: /
Product Details
Product Name: LD Laser Heat Sink
Production Process: DPC
Finished Thickness: Aluminum Nitride 0.25mm, 0.38mm
Surface Treatment: Gold Plating + Gold Tin
Remarks: Trace Width/Spacing 0.08mm
Product Details
Product Name: Lighting
Production Process: DPC
Finished Thickness: Aluminum Oxide 0.38mm, 0.5mm
Surface Treatment: Silver Immersion, ENIG, Nickel Palladium Gold
Remarks: 3535, 5050
Product Details
Sensor Ceramic Substrate PCB
Product Details
Sensor Ceramic Substrate PCB
Product Details
Silicon Nitride Ceramic Substrate PCB
Product Details
Custom Ceramic Substrate PCB
Only branded materials are used, and all raw materials undergo testing for various indicators. Any materials that do not meet the standards are immediately returned or replaced.
With multiple imported equipment such as LDI laser exposure machines, vacuum etching machines, and character inkjet printers, the machining accuracy has been significantly improved.
Each production stage is monitored by dedicated QC inspectors, with operators performing self-inspection and QA conducting random checks, ensuring quality control at every step.
Imported instruments and equipment such as 2D measuring machines, copper thickness testers, impedance testers, and gold thickness testers ensure performance.
